Capabilities

• Prototyping and pre-production up to high volume production
• Lead-free assembly
• SMT facilities
• Placement of 0201 components
• 0.4mm pitch Ball Grid Array (BGA) placement
• Odd-form component placement
• Rework facilities including BGA
• In-process electrical verification of components
• Automated Optical Inspection (AOI)
• Assembly
  • Mechanical integration expertise
  • Wiring, looming and harnessing
• Test
  • Full test solution development
  • Board level testing to final system testing
  • RF test specialists (up to 40GHz)
  • Environmental testing / Stress & “burn-in” testing
  • Temperature, shock/vibration, humidity, altitude, salt spray
  • UV exposure / accelerated weather testing