Capabilities

  • Prototyping and pre-production up to high volume production
  • Lead-free assembly
  • SMT facilities
    • Placement of 0201 components
    • 0.4mm pitch Ball Grid Array (BGA) placement
    • Odd-form component placement
    • Rework facilities including BGA
    • In-process electrical verification of components
    • Automated Optical Inspection (AOI)
  • Assembly
    • Mechanical integration expertise
    • Wiring, looming and harnessing
  • Test
    • Full test solution development
    • Board level testing to final system testing
    • RF test specialists (up to 40GHz)
    • Environmental testing / Stress & “burn-in” testing
      • Temperature, shock/vibration, humidity, altitude, salt spray
      • UV exposure / accelerated weather testing



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